Electronic device

ABSTRACT

An electronic device includes a system board, a power module and a conductive part. The system board includes a first surface and a second surface opposite to each other. The power module is disposed on the second surface and provides power to the semiconductor device through the system board. The conductive part is disposed on a first side of the power module adjacent to the second surface, wherein the conductive part is electrically connected with the and the system board, wherein the power is transmitted between the and the semiconductor device through the conductive part. The power module includes at least one switch circuit and a magnetic core assembly. The at least one switch circuit disposed on a second side of the power module away from the conductive part. The magnetic core assembly is arranged between the switch circuit and the conductive part.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of U.S. application Ser.No. 16/591,062 filed on Oct. 2, 2019, and entitled “VOLTAGE REGULATORMODULE”, which claims the benefit of U.S. Provisional Application Ser.No. 62/743,251 filed on Oct. 9, 2018, claims the benefit of U.S.Provisional Application Ser. No. 62/770,432 filed on Nov. 21, 2018,claims priority to China Patent Application No. 201811519354.1 filed onDec. 12, 2018, and claims priority to China Patent Application No.201910900102.1 filed on Sep. 23, 2019, the entire contents of which areincorporated herein by reference for all purposes.

FIELD OF THE INVENTION

The present disclosure relates to a voltage regulator module, and moreparticularly to a voltage regulator module capable of reducing loss,increasing heat dissipation efficiency, withstanding increased pressure,disposing more output capacitors therein and/or decreasing the volumethereof.

BACKGROUND OF THE INVENTION

Please refer to FIGS. 1A and 1B. FIG. 1A schematically illustrates thestructure of a conventional electronic device. FIG. 1B schematicallyillustrates the structure of a voltage regulator module of theelectronic device as shown in FIG. 1A. As shown in FIGS. 1A and 1B, theelectronic device 1 includes a central processing unit (CPU) 11, avoltage regulator module 12 and a system board 13. The voltage regulatormodule 12 is used for converting an input voltage into a regulatedvoltage and providing the regulated voltage to the central processingunit 11. The voltage regulator module 12 and the central processing unit11 are disposed on a first surface of the system board 13. For meetingthe load dynamic switching requirements, the output terminal of thevoltage regulator module 12 is located near the input terminal of thecentral processing unit 11.

Moreover, the voltage regulator module 12 further includes an outputcapacitor 14, a printed circuit board 15 and a magnetic element 16. Theoutput capacitor 14 is disposed on a second surface of the system board13. The first surface and the second surface of the system board 13 areopposed to each other. The output capacitor 14 is located beside theinput terminal of the central processing unit 11. The magnetic element16 is disposed on the printed circuit board 15. Moreover, a switchelement is disposed in a vacant space between the printed circuit board15 and the magnetic element 16. The printed circuit board 15 is disposedon the first surface of the system board 13. The heat from the voltageregulator module 12 can be transferred to the system board 13 throughthe printed circuit board 15. Moreover, the heat is dissipated awaythrough a heat dissipation mechanism (not shown) of the system board 13.

Recently, the required current for the central processing unit 11 isgradually increased. In addition, the trend of the volume of theelectronic device is toward miniaturization. Since the centralprocessing unit 11 and the voltage regulator module 12 are located atthe same side of the system board 13, the electronic device cannot meetthe load dynamic switching requirements.

For reducing the volume of the electronic device and effectivelyenhancing the dynamic switching performance of the voltage regulatormodule, another electronic device is disclosed. FIG. 2 schematicallyillustrates the structure of another conventional electronic device. Inthe electronic device 1′ of FIG. 2 , the voltage regulator module 12 isdisposed on the second surface of the system board 13. That is, thevoltage regulator module 12 is located at the position of the outputcapacitor 14 as shown in FIG. 1A. Under this circumstance, the voltageregulator module 12 and the central processing unit 11 are located atopposite sides of the system board 13. Correspondingly, the layout ofthe inner components of the voltage regulator module 12 needs to beadjusted. For example, the installation position of the output capacitoris changed from the second surface of the system board 13 to the innerspace of the voltage regulator module 12. Consequently, the volume ofthe electronic device 1′ is effectively reduced. Moreover, the outputcapacitor 14 is located near the output terminal of the voltageregulator module 12 and the input terminal of the central processingunit 11, the dynamic switching performance of the voltage regulatormodule 12 is enhanced.

Although the dynamic switching performance of the voltage regulatormodule 12 of the electronic device 1′ as shown in FIG. 2 is enhanced,there are still some drawbacks. For example, the first side of thevoltage regulator module 12 is welded on the system board 13, and thesecond side of the voltage regulator module 12 is fixed on the casing ofthe electronic device 1′ through a heat sink and spring screws. Firstly,the heat from the voltage regulator module 12 cannot be effectivelytransferred to the casing of electronic device 1′ and dissipated awaythrough the casing of the electronic device 1′. Secondly, the voltageregulator module 12 is unable to withstand the pressure from the heatsink and the spring screws. As mentioned above, the output capacitor isdisposed within the voltage regulator module. Thirdly, a plurality ofball grid arrays are usually mounted on the printed circuit board of thevoltage regulator module 12. In case that the force applied to the ballgrid arrays is not uniform, the soldering material is possibly crackedor detached and the product reliability is impaired. For solving thisproblem, the surface of the printed circuit board of the voltageregulator module 12 has to provide a large space for improving the forceon the ball grid arrays. However, the installation space of the outputcapacitor is restricted. That is, the voltage regulator module 12 cannotbe equipped with more output capacitors according to the practicalrequirements. Fourthly, the voltage regulator module 12 includes aplurality of components for transferring signals. For example, a signalcommunication part composed of a plurality of pins is disposed withinthe voltage regulator module 12. The plurality of pins of the signalcommunication part are mounted on the printed circuit board of thevoltage regulator module 12. Since the gap between every two pins of thesignal communication part is large, the number of pins mounted on thegiven area is limited. That is, the distribution density of the pins islow. Moreover, since the cross-section area of each pin is small, thereliability of mounting the pin is usually unsatisfied. In case that thesoldering materials between the pins are connected, a short-circuitedproblem occurs.

Therefore, there is a need of providing an improved voltage regulatormodule in order to overcome the drawbacks of the conventionaltechnologies.

SUMMARY OF THE INVENTION

In accordance with an aspect of the present disclosure, a voltageregulator module is provided. The voltage regulator module includes afirst circuit board assembly and a magnetic core assembly. The firstcircuit board assembly includes a first printed circuit board, aplurality of switch elements and a first molding compound layer. Theplurality of switch elements are mounted on a first surface of the firstprinted circuit board. The first molding compound layer is formed on thefirst surface of the first printed circuit board to encapsulate theplurality of switch elements. The magnetic core assembly is arrangedbeside a second surface of the first printed circuit board, and includesa magnetic core portion and at least one first U-shaped copperstructure. The magnetic core portion includes a plurality of openings.Each of the at least one first U-shaped copper structure is penetratedthrough two corresponding openings to define at least two inductors. Afirst terminal of each inductor and the corresponding switch element areconnected in series to define a phase circuit.

From the above descriptions, the present disclosure provides a voltageregulator module. The first U-shaped copper structures are penetratedthrough the magnetic core portion to define the inductors. Since theU-shaped copper structure has good supporting property and thermalconductivity, the capability of the voltage regulator module towithstand the pressure from the casing of the electronic device will beenhanced. Due to the good thermal conductivity of copper, the heat fromthe inductor can be transferred rapidly and effectively. Consequently,the thermal resistance in the thermal conduction path is decreased.

Moreover, the output capacitor is embedded within the second printedcircuit board or encapsulated on the second printed circuit board.Consequently, the areas of the bonding pads on the second printedcircuit board to weld the magnetic core assembly will be increased.Since the pressure applied to the ball grid arrays of the second printedcircuit board is distributed more uniformly, the product reliability isenhanced and more output capacitors can be mounted on the second printedcircuit board.

Moreover, a signal communication part includes a conduction circuitboard with a plurality of conduction fingers and a plurality of surfacepins. While the signal communication part is welded on the bonding padsof the first circuit board assembly or the second circuit boardassembly, the lateral solder wicking efficacy is achieved and thesoldering material is not spread to the adjacent pins. Since thesoldering materials between the two surface pins are not connected, theshort-circuited problem is avoided. Under this circumstance, the gapbetween the adjacent surface pins of the signal communication part isreduced, and the pins distribution density is increased. Consequently,the volume of the voltage regulator module is reduced, and power densityof the voltage regulator module is enhanced.

The above contents of the present disclosure will become more readilyapparent to those ordinarily skilled in the art after reviewing thefollowing detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A schematically illustrates the structure of a conventionalelectronic device;

FIG. 1B schematically illustrates the structure of a voltage regulatormodule of the electronic device as shown in FIG. 1A;

FIG. 2 schematically illustrates the structure of another conventionalelectronic device;

FIG. 3A is a schematic exploded view illustrating a voltage regulatormodule according to a first embodiment of the present disclosure andtaken along a viewpoint;

FIG. 3B is a schematic exploded view illustrating the voltage regulatormodule of FIG. 3A and taken along another viewpoint;

FIG. 3C is a schematic cross-sectional view illustrating a variantexample of a first circuit board assembly of the voltage regulatormodule according to the first embodiment of the present disclosure;

FIG. 3D schematically illustrates the layout structure of the electroniccomponents on the first surface of the first printed circuit board ofthe voltage regulator module according to the first embodiment of thepresent disclosure;

FIG. 4 is a schematic equivalent circuit diagram illustrating thevoltage regulator module of FIG. 3A;

FIG. 5 is a schematic cross-sectional view illustrating an example ofinstalling the output capacitor in the second printed circuit boardaccording to the first embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view illustrating an example ofencapsulating the output capacitor in the second printed circuit boardaccording to the first embodiment of the present disclosure;

FIG. 7 is a schematic cross-sectional view illustrating a variantexample of encapsulating the output capacitor in the second printedcircuit board;

FIG. 8 is a schematic cross-sectional view illustrating the magneticcore portion of the magnetic core assembly of the voltage regulatormodule according to the first embodiment of the present disclosure;

FIG. 9A is a schematic exploded view illustrating a voltage regulatormodule according to a second embodiment of the present disclosure andtaken along a viewpoint;

FIG. 9B is a schematic exploded view illustrating the voltage regulatormodule of FIG. 9A and taken along another viewpoint; and

FIG. 10 is a planar view illustrating a signal communication part of thevoltage regulator module as shown in FIG. 9A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present disclosure will now be described more specifically withreference to the following embodiments. It is to be noted that thefollowing descriptions of preferred embodiments of this disclosure arepresented herein for purpose of illustration and description only. It isnot intended to be exhaustive or to be limited to the precise formdisclosed.

Please refer to FIGS. 3A, 3B and 4 . FIG. 3A is a schematic explodedview illustrating a voltage regulator module according to a firstembodiment of the present disclosure and taken along a viewpoint. FIG.3B is a schematic exploded view illustrating the voltage regulatormodule of FIG. 3A and taken along another viewpoint. FIG. 4 is aschematic equivalent circuit diagram illustrating the voltage regulatormodule of FIG. 3A. The voltage regulator module 3 may be installed in anelectronic device. In case that the central processing unit of theelectronic device requires a large amount of current, the voltageregulator module 3 is a multi-phase buck converter. Consequently, thecapability of the voltage regulator module 3 to output electricity iseffectively enhanced. The voltage regulator module 3 includes aplurality of switch elements 30, a plurality of inductors L, at leastone input capacitor Cin and at least one output capacitor Cout. Forexample, the switch elements 30 are driver and metal-oxide-semiconductorfield-effect transistors (also referred as a Dr.MOS element).

As shown in FIG. 4 , each Dr.MOS element 30 and a first terminal SW ofthe corresponding inductor L are electrically connected with each otherin series to define a phase buck circuit. In this embodiment, thevoltage regulator module 3 includes eight phase buck circuits, i.e., thefirst phase buck circuit to the eighth phase buck circuit from top tobottom. In other words, the voltage regulator module 3 includes eightDr.MOS elements 30 and eight inductors L. The input side of the voltageregulator module 3 includes a positive input end Vin+ and a negativeinput end Vin−. The first terminals of the eight phase buck circuits areconnected with each other in parallel and electrically connected withthe input capacitor Cin. The output side of the voltage regulator module3 includes a positive output terminal Vo+ and a negative output terminalVo−. The negative input end Vin− and the negative output terminal Vo−are electrically connected with a common terminal. The second terminalsof the eight phase buck circuits are connected with each other inparallel and electrically connected with the output capacitor Cout. Afirst terminal of the output capacitor Cout is electrically connectedwith the positive output terminal Vo+ of the voltage regulator module 3.A second terminal of the output capacitor Cout is electrically connectedwith the negative output terminal Vo− of the voltage regulator module 3.A first terminal of the input capacitor Cin is electrically connectedwith the positive input end Vin+ of the voltage regulator module 3. Asecond terminal of the input capacitor Cin is electrically connectedwith the negative input end Vin− of the voltage regulator module 3.

In an embodiment, each Dr.MOS element 30 includes a switch and a driverfor driving the switch. The Dr.MOS element 30 has a heat dissipationsurface for dissipating heat along a single side. Moreover, the voltageregulator module 3 further includes a control circuit 40. After thecontrol circuit 40 samples the output voltage of the voltage regulatormodule 3 and the output current of each phase buck circuit, the controlcircuit 40 generates four pulse width modulation signals PWM1, PWM2,PWM3 and PWM4. The phase difference between every two adjacent pulsewidth modulation signals is 90 degree. Every two adjacent phase buckcircuits are controlled by the control circuit 40 according to one pulsewidth modulation signal. For example, the first phase buck circuit andthe second phase buck circuit are controlled according to the firstpulse width modulation signal PWM1, the third phase buck circuit and thefourth phase buck circuit are controlled according to the second pulsewidth modulation signal PWM2, the fifth phase buck circuit and the sixthphase buck circuit are controlled according to the third pulse widthmodulation signal PWM3, and the seventh phase buck circuit and theeighth phase buck circuit are controlled according to the fourth pulsewidth modulation signal PWM4.

In accordance with a feature of the present disclosure, the voltageregulator module 3 is a multi-layered structure with more than twolayers. Consequently, the ability of the voltage regulator module 3 towithstand the pressure from the casing of the electronic device isincreased, and the heat from the voltage regulator module 3 iseffectively transferred to the casing or the heat sink of the electronicdevice. In the embodiment as shown in FIGS. 3A and 3B, the voltageregulator module 3 is a three-layered structure comprising a firstcircuit board assembly 50, a magnetic core assembly 60 and a secondcircuit board assembly 70. The first circuit board assembly 50 includesa first printed circuit board 501 and a first molding compound layer502. All Dr.MOS elements 30 and all input capacitors Cin are mounted ona first surface 50 a of the first printed circuit board 501 by a weldingprocess or through a conductive adhesive (see FIG. 3D). The heatdissipation surfaces of the Dr.MOS elements 30 are in contact with thefirst surface 50 a of the first printed circuit board 501. The firstmolding compound layer 502 is disposed on the first surface 50 a of thefirst printed circuit board 501. The first surface 50 a of the firstprinted circuit board 501, the Dr.MOS elements 30 and the inputcapacitors Cin are encapsulated by the first molding compound layer 502through a plastic molding process. An external surface 503 of the firstmolding compound layer 502 is a flat surface. The external surface 503is attached and fixed on a casing or a heat sink of the electronicdevice. Since the external surface 503 is a flat surface, the contactarea between the external surface 503 and the casing (or the heat sink)is increased. The increased contact area is helpful to reduce thethermal resistance, increase the heat dissipating capability of thevoltage regulator module 3, uniformly distribute the pressure from thecasing and increase the pressure resistance of the first circuit boardassembly 50.

As shown in FIG. 3B, two first bonding pads P1, four pairs of secondbonding pads P2, an even number of third bonding pads, a plurality ofperforations 511 and at least one blind hole 512 are disposed on asecond surface 50 b of the first printed circuit board 501. The firstbonding pads P1 are electrically connected with the positive input endVin+ of the voltage regulator module 3. The second bonding pads P2 areelectrically connected with the negative output terminal Vo− of thevoltage regulator module 3. In this embodiment, the even number of thirdbonding pads include eight third bonding pads SW1, SW2, SW3, SW4, SW5,SW6, SW7 and SW8. Each third bonding pad is electrically connected withthe first terminal SW of the corresponding inductor L. The perforations511 run through the first printed circuit board 501. The blind hole 512does not run through the first printed circuit board 501.

It is noted that numerous modifications and alterations may be madewhile retaining the teachings of the disclosure. FIG. 3C is a schematiccross-sectional view illustrating a variant example of a first circuitboard assembly of the voltage regulator module according to the firstembodiment of the present disclosure. In this embodiment, each Dr.MOSelement 30 has a first heat dissipation surface and a second heatdissipation surface, which are opposed to each other. Consequently, theheat can be dissipated along bilateral sides. The first heat dissipationsurface is in contact with the first surface 50 a of the first printedcircuit board 501. After the first surface 50 a of the first printedcircuit board 501, the Dr.MOS elements 30 and the input capacitors Cinare encapsulated by the first molding compound layer 502, the externalsurface 503 of the first molding compound layer 502 is polished.Consequently, the second heat dissipation surfaces of the Dr.MOSelements 30 are exposed outside the external surface 503 of the firstmolding compound layer 502. Then, the Dr.MOS elements 30 are indirectlyattached on the casing of the electronic device through a heat sink ordirectly attached on the casing of the electronic device. In such way,the thermal resistance is reduced, and the heat dissipating efficacy isenhanced.

FIG. 3D schematically illustrates the layout structure of the electroniccomponents on the first surface of the first printed circuit board ofthe voltage regulator module according to the first embodiment of thepresent disclosure. As shown in FIG. 3D, the eight Dr.MOS elements 30are divided into two rows. The four Dr.MOS elements 30 in the first rowand the four Dr.MOS elements 30 in the second row are mounted on thefirst surface 50 a of the first printed circuit board 501. Theinstallation directions of the four Dr.MOS elements 30 in the first roware identical. The installation directions of the four Dr.MOS elements30 in the second row are identical. Moreover, the installationdirections of the four Dr.MOS elements 30 in the first row and theinstallation directions of the four Dr.MOS elements 30 in the second roware opposite. In this design, the wires between the eight Dr.MOSelements 30 and the first terminals SW of the corresponding inductors Lare shorter. The input capacitors Cin are uniformly distributed aroundthe Dr.MOS elements 30.

Please refer to FIGS. 3A and 3B again. The magnetic core assembly 60 isarranged beside the first circuit board assembly 50. In this embodiment,the magnetic core assembly 60 is located under the first circuit boardassembly 50 and arranged beside the second surface 50 b of the firstprinted circuit board 501. The magnetic core assembly 60 includes amagnetic core portion 610 and at least one first U-shaped copperstructure. Each first U-shaped copper structure is penetrated throughthe magnetic core portion 610. Consequently, two inductors are definedby the magnetic core portion 610 and the two lateral posts of the firstU-shaped copper structure. In this embodiment, the voltage regulatormodule 3 includes eight phase buck circuits. That is, the voltageregulator module 3 includes eight inductors L. As shown in FIGS. 3A and3B, the magnetic core assembly 60 includes four first U-shaped copperstructures 621, 623, 625 and 627. The eight lateral posts of the fourfirst U-shaped copper structures 621, 623, 625 and 627 are correlated tothe eight windings of the eight inductors L.

As mentioned above, each first U-shaped copper structure is penetratedthrough the magnetic core portion 610 to define two inductors L.Consequently, the eight inductors L are defined by four first U-shapedcopper structures. Under this circumstance, the number of the firstU-shaped copper structures is decreased. Moreover, since the U-shapedcopper structure has good supporting property and thermal conductivity,the U-shaped copper structure can be arranged between the first circuitboard assembly 50 and the second circuit board assembly 70 to supportthe first circuit board assembly 50 and the second circuit boardassembly 70. Consequently, the capability of the voltage regulatormodule 3 to withstand the pressure from the casing of the electronicdevice will be enhanced. Due to the good thermal conductivity of copper,the heat from the inductor L can be transferred rapidly and effectively.Consequently, the thermal resistance in the thermal conduction path isdecreased. Due to low resistivity of copper, the conduction resistanceof the inductor is decreased. Consequently, the conduction loss of theinductor is decreased, and the conversion efficiency of the voltageregulator module 3 is increased.

Please refer to FIGS. 3A, 3B and 4 again. The second circuit boardassembly 70 includes a second printed circuit board 703 and at least oneoutput capacitor Cout. Preferably but not exclusively, the at least oneoutput capacitor Cout is embedded within the second printed circuitboard 703. The second printed circuit board 703 includes a fourthbonding pad P4, four fifth bonding pads P5, four sixth bonding pads P6a, P6 b, P6 c, P6 d, a plurality of blind holes 711 and a plurality ofball grid arrays (BGA) B. The fourth bonding pad P4, the four fifthbonding pads P5, the four sixth bonding pads P6 a, P6 b, P6 c, P6 d andthe plurality of blind holes 711 are installed on/in a first surface 70a of the second printed circuit board 703. The first surface 70 a of thesecond printed circuit board 703 is arranged beside the magnetic coreassembly 60. The fourth bonding pad P4 is electrically connected withthe positive input end Vin+ of the voltage regulator module 3. The fourfifth bonding pads P5 are electrically connected with the negativeoutput terminal Vo− of the voltage regulator module 3. The sixth bondingpads P6 a, P6 b, P6 c and P6 d are electrically connected with thepositive output terminal Vo+ of the voltage regulator module 3. Theplurality of ball grid arrays B are disposed on a second surface 70 b ofthe second printed circuit board 703. The plurality of ball grid arraysB are electrically connected with the ball grid arrays of the centralprocessing unit on the system board of the electronic device.Preferably, the gaps and networks of the plurality of ball grid arrays Bon the second surface 70 b of the second printed circuit board 703correspond to those of the ball grid arrays on the system board. Theplurality of ball grid arrays B are electrically connected with theplurality of bonding pads on the first surface 70 a of the secondprinted circuit board 703 through the internal traces of the secondprinted circuit board 703.

Generally, the voltage regulator module 3 withstands the pressure fromthe electronic device because of screwing means or other reasons. Incase that the first surface 70 a of the second printed circuit board 703is exerted by the pressure uniformly, the plurality of ball grid arraysB on the second surface 70 b of the second printed circuit board 703 areexerted by the pressure uniformly. Whereas, in case that the ball gridarrays B are exerted by the pressure non-uniformly and some ball gridarrays B withstand the larger pressure, the soldering material ispossibly cracked or detached and the product reliability is impaired.For solving this problem, the areas of the bonding pads on the firstsurface 70 a of the second printed circuit board 703 to weld themagnetic core assembly 60 need to be increased. However, as the areas ofthe bonding pads are increased, the layout area for placing the outputcapacitors Cout is decreased. In accordance with the present disclosure,the output capacitors Cout are embedded or encapsulated. The approach ofembedding or encapsulating the output capacitors Cout will be describedas follows.

FIG. 5 is a schematic cross-sectional view illustrating an example ofembedding the output capacitor in the second printed circuit boardaccording to the first embodiment of the present disclosure. Forsuccinctness, only one output capacitor Cout embedded in the secondprinted circuit board 703 is shown in FIG. 5 . The second printedcircuit board 703 includes a substrate 723, an interface layer 724, aplurality of first electroplating layers 731, 731′, a plurality ofsecond electroplating layers 732, 732′, a plurality of first insulationlayers 733, 733′ and a plurality of second insulation layers 734, 734′.

The substrate 723 includes a plurality of bonding pads 727. The outputcapacitor Cout is welded on the corresponding bonding pads 727. That is,the output capacitor Cout is fixed on the substrate 723 through thebonding pads 727. For example, the interface layer 724 is made ofAjinomoto Build-up Film (ABF). The output capacitor Cout is mounted on afirst surface of the substrate 723. The interface layer 724 is formedover the first surface of the substrate 723 and the output capacitorCout. After the interface layer 724 is baked at a specified temperature(e.g., 180° C.) for a specified time period (e.g., 30 minutes), theinterface layer 724 is solidified into an insulation layer.

The first electroplating layers 731 and 731′ are copper layers that arelaminated and electroplated on a top surface of the interface layer 724and a second surface of the substrate 723, respectively. The thicknessof the first electroplating layer 731 (and 731′) is about 3 OZ.Moreover, two plated through holes are formed in the interface layer724, and two plated through holes are formed in the substrate 723. Thetwo plated through holes of the interface layer 724 and the two platedthrough holes of the substrate 723 are aligned with the two bonding pads727, respectively. Moreover, the two plated through holes of theinterface layer 724 and the two plated through holes of the substrate723 are connected with each other through the two bonding pads 727,which are connected with the output capacitor Cout.

The first insulation layers 733 and 733′ are formed on a top surface ofthe first electroplating layer 731 and a bottom surface of the firstelectroplating layer 731′, respectively.

The second electroplating layers 732 and 732′ are copper layers that arelaminated and electroplated on a top surface of the first insulationlayer 733 and a bottom surface of the first insulation layer 733′,respectively. The thickness of the second electroplating layer 732 (and732′) is about 3 OZ. Moreover, two plated through holes are formed inthe first insulation layer 733, and two plated through holes are formedin the first insulation layer 733′. The two plated through holes of thefirst insulation layer 733 are aligned and contacted with the two platedthrough holes of the interface layer 724 so that the two plated throughholes of the first insulation layer 733 are connected with the twobonding pads 727, which are connected with the output capacitor Cout.The two plated through holes of the first insulation layer 733′ arealigned and contacted with the two plated through holes of the substrate723 so that the two plated through holes of the first insulation layer733′ are connected with the two bonding pads 727, which are connectedwith the output capacitor Cout.

The second insulation layers 734 and 734′ are formed on a top surface ofthe second electroplating layer 732 and a bottom surface of the secondelectroplating layer 732′, respectively. Two electroplating layers (i.e.two cooper layers) are laminated and electroplated on a top surface ofthe second insulation layer 734 and a bottom surface of the secondinsulation layer 734′, respectively, so as to form a first surface 70 aand a second surface 70 b of the second printed circuit board 703. Thethickness of the electroplating layer is about 3 OZ. Moreover, twoplated through holes are formed in the second insulation layer 734, andtwo plated through holes are formed in the second insulation layer 734′.The two plated through holes of the second insulation layer 734 arealigned and contacted with the two plated through holes of the firstinsulation layer 733 so that the two plated through holes of the secondinsulation layer 734 are connected with the two plated through holes ofthe first insulation layer 733, the two plated through holes of theinterface layer 724 and the two bonding pads 727, which are connectedwith the output capacitor Cout. The two plated through holes of thesecond insulation layer 734′ are aligned and contacted with the twoplated through holes of the first insulation layer 733′ so that the twoplated through holes of the second insulation layer 734′ are connectedwith the two plated through holes of the first insulation layer 733′,the two plated through holes of the substrate 723 and the two bondingpads 727, which are connected with the output capacitor Cout.

In the upper half and left side of the second printed circuit boardassembly 70, one of the plated through holes of the second insulationlayer 734, one of the plated through holes of the first insulation layer733 and one of the plated through holes of the interface layer 724 arecollaboratively defined as a first conducting line 725. In the lowerhalf and left side of the second printed circuit board assembly 70, oneof the plated through holes of the second insulation layer 734′, one ofthe plated through holes of the first insulation layer 733′ and one ofthe plated through holes of the substrate 723 are collaborativelydefined as a first conducting line 725′. In the upper half and rightside of the second printed circuit board assembly 70, the other one ofthe plated through holes of the second insulation layer 734, the otherone of the plated through holes of the first insulation layer 733 andthe other one of the plated through holes of the interface layer 724 arecollaboratively defined as a second conducting line 726. In the lowerhalf and right side of the second printed circuit board assembly 70, theother one of the plated through holes of the second insulation layer734′, the other one of the plated through holes of the first insulationlayer 733′ and the other one of the plated through holes of thesubstrate 723 are collaboratively defined as a second conducting line726′. Namely, the plated through holes of the above layers in the leftside are collaboratively defined as a first conducting line. The platedthrough holes of the above layers in the right side are collaborativelydefined as a second conducting line. The first conducting line 725, 725′is electrically connected with the first terminal of the outputcapacitor Cout, the positive output terminal Vo+ of the voltageregulator module 3 and the first surface 70 a and the second surface 70b of the second printed circuit board 703. The second conducting line726, 726′ is connected with the second terminal of the output capacitorCout, the negative output terminal Vo− of the voltage regulator module 3and the first surface 70 a and the second surface 70 b of the secondprinted circuit board 703. Since the output capacitors Cout are embeddedin the second printed circuit board 703, the voltage regulator module 3can be equipped with more output capacitors. In addition, the outputcapacitors Cout are not interfered by other components of the secondprinted circuit board 703.

FIG. 6 is a schematic cross-sectional view illustrating an example ofencapsulating the output capacitor in the second printed circuit boardaccording to the first embodiment of the present disclosure. In thisembodiment, the output capacitor Cout is encapsulated in the secondprinted circuit board 703. As shown in FIG. 6 , the output capacitorCout is fixed on the first surface 70 a of the second printed circuitboard 703. The second circuit board assembly 70 further includes aplurality of copper blocks 771 and a second molding compound layer 704.The copper blocks 771 are fixed on the first surface 70 a of the secondprinted circuit board 703 to provide a supporting function. The firstsurface 70 a of the second printed circuit board 703, the outputcapacitor Cout and the plurality of copper blocks 771 are encapsulatedby the second molding compound layer 704 through a plastic moldingprocess.

In an embodiment, the copper blocks 771 are rectangular structures.Moreover, the top surfaces of the copper blocks 771 are exposed outsidethe top surface of the second molding compound layer 704 through naturalexposure or a polishing process. The fourth bonding pad P4 iselectroplated on the top surfaces of the second molding compound layer704 and electrically connected with the corresponding copper blocks 771exposed outside the second molding compound layer 704. The copper blocks771 are higher than the output capacitor Cout. Consequently, after theplastic molding process, the top surfaces of the copper blocks 771 areexposed outside the top surface of the second molding compound layer 704through natural exposure or the polishing process. Similarly, the fourfifth bonding pads P5 and the four sixth bonding pads P6 a, P6 b, P6 c,P6 d may be electroplated on the top surface of the second moldingcompound layer 704 and electrically connected with the exposed copperblocks.

FIG. 7 is a schematic cross-sectional view illustrating a variantexample of encapsulating the output capacitor in the second printedcircuit board. In this embodiment, each of the copper blocks 771 is atrapezoidal column structure with a bottom surface and a top surface.The area of the bottom surface is smaller than the area of the topsurface. The bottom surfaces of the trapezoidal column structures arefixed on the first surface 70 a of the second printed circuit board 703.Moreover, the top surfaces of the trapezoidal column structures areexposed outside the top surface of the second molding compound layer 704through natural exposure or a polishing process. The fourth bonding padP4 and the fifth bonding pads P5 (and/or the sixth bonding pads P6 a, P6b, P6 c, P6 d) are formed on the exposed copper blocks 771.

Preferably, the area of the top surface of the trapezoid columnstructure is at least 1.3 times the area of the bottom surface of thetrapezoid column structure. In the embodiment of FIG. 6 or FIG. 7 , theoutput capacitor Cout is encapsulated in the second printed circuitboard 703. Since the top side of the second circuit board assembly 70 isa flat plane, the larger-size bonding pad can be formed on the flatplane and the contact area between the second circuit board assembly 70and the magnetic core assembly 60 is increased. Since the area of thesecond circuit board assembly 70 to receive the pressure is increased,the pressure applied to the ball grid arrays B on the second surface 70b of the second printed circuit board 703 is distributed more uniformly.Under this circumstance, the product reliability is enhanced.

Please refer to FIGS. 3A, 3B and 8 . FIG. 8 is a schematiccross-sectional view illustrating the magnetic core portion of themagnetic core assembly of the voltage regulator module according to thefirst embodiment of the present disclosure. The magnetic core portion610 includes four core units 611, 613, 615 and 617, which are connectedwith each other. Preferably but not exclusively, each of the core units611, 613, 615 and 617 is a square core with four rounded corners.Alternatively, each core unit is a circular core. Two parallel openings811 are formed in a middle region of the core unit 611. Two parallelopenings 813 are formed in a middle region of the core unit 613. Twoparallel openings 815 are formed in a middle region of the core unit615. Two parallel openings 817 are formed in a middle region of the coreunit 617. Preferably but not exclusively, the openings 811, 813, 815,817 are square-shaped. The sizes and shapes of the openings 811, 813,815 and 817 match the sizes and shapes of the lateral posts of the firstU-shaped copper structures 621, 623, 625 and 627, respectively. Thelateral posts of the first U-shaped copper structures 621, 623, 625 and627 are respectively penetrated through the openings 811, 813, 815 and817 to define eight inductors L. For example, the two lateral posts ofthe first U-shaped copper structure 621 are penetrated through theopenings 811, respectively. Consequently, the inductor L of the firstphase buck circuit and the inductor L of the second phase buck circuitare defined by the two lateral posts of the first U-shaped copperstructure 621 and the core unit 611 collaboratively. The rest may bededuced by analogy.

The first U-shaped copper structure 621 includes two top surfaces 641and 642 and a bottom surface 651. The two top surfaces 641 and 642 arefixed on and electrically connected with the two third bonding pads SW1and SW2 on the second surface 50 b of the first printed circuit board501. The bottom surface 651 is fixed on and electrically connected withthe sixth bonding pad P6 a of the second circuit board assembly 70. Thefirst U-shaped copper structure 623 includes two top surfaces 643 and644 and a bottom surface 653. The two top surfaces 643 and 644 are fixedon and electrically connected with the two third bonding pads SW3 andSW4 on the second surface 50 b of the first printed circuit board 501.The bottom surface 653 is fixed on and electrically connected with thesixth bonding pad P6 b of the second circuit board assembly 70. Thefirst U-shaped copper structure 625 includes two top surfaces 645 and646 and a bottom surface 655. The two top surfaces 645 and 646 are fixedon and electrically connected with the two third bonding pads SW5 andSW6 on the second surface 50 b of the first printed circuit board 505.The bottom surface 655 is fixed on and electrically connected with thesixth bonding pad P6 c of the second circuit board assembly 70. Thefirst U-shaped copper structure 627 includes two top surfaces 647 and648 and a bottom surface 657. The two top surfaces 647 and 648 are fixedon and electrically connected with the two third bonding pads SW7 andSW8 on the second surface 50 b of the first printed circuit board 507.The bottom surface 657 is fixed on and electrically connected with thesixth bonding pad P6 d of the second circuit board assembly 70.

In the magnetic core portion 610, the magnetic field lines of every twoadjacent core units 611, 613, 615, 617 are overlapped to create a firstmagnetic overlap region. For example, three first magnetic overlapregions 831, 832 and 833 indicated by oblique lines are shown in FIG. 8. In each core unit 611, 613, 615, 617, the magnetic field lines ofevery two inductors are overlapped to create a second magnetic overlapregion. For example, four second magnetic overlap regions 841, 842, 843and 844 are shown in FIG. 8 . Each second magnetic overlap region isarranged between the two openings of the corresponding core unit. In thethree first magnetic overlap regions 831, 832 and 833, the DC magneticfluxes are balanced out and the AC magnetic fluxes are superposed. Inthe four second magnetic overlap regions 841, 842, 843 and 844, the DCmagnetic fluxes are balanced out and the AC magnetic fluxes are balancedout. However, since the device parameters and the parasitic parametersof the two-phase buck circuits corresponding to the pulse widthmodulation signal are not always identical. Consequently, the DCmagnetic fluxes and the AC magnetic fluxes in the four second magneticoverlap regions 841, 842, 843 and 844 cannot be completely balanced out.That is, a small amount of DC magnetic flux and a small amount of ACmagnetic flux are retained. In some embodiments, the area of each firstmagnetic overlap region (e.g., 831, 832 or 833) is smaller than twotimes the area of the non-magnetic overlap region of each core unit(e.g., 801, 802, 803 or 804), and the area of each second magneticoverlap region (841, 842, 843 or 844) is smaller than a half area of thearea of the non-magnetic overlap region of each core unit (e.g., 801,802, 803 or 804). The overlap regions of FIG. 8 are presented herein forpurpose of illustration and description only.

Each of the core units 611, 613, 615 and 617 includes two air gaps. Thecore unit 611 includes the two air gaps 821 and 822, which aresymmetrically arranged at two opposite sides of the openings 811. Thecore unit 613 includes the two air gaps 823 and 824, which aresymmetrically arranged at two opposite sides of the openings 813. Thecore unit 615 includes the two air gaps 825 and 826, which aresymmetrically arranged at two opposite sides of the openings 815. Thecore unit 617 includes the two air gaps 827 and 828, which aresymmetrically arranged at two opposite sides of the openings 817. Theseair gaps can withstand the magnetic pressure averagely. Preferably, themagnetic core portion 610 is an integral structure. Moreover, thecombination of the magnetic core portion 610 and the first U-shapedcopper structures 621, 623, 625 and 627 is installed between the firstcircuit board assembly 50 and the second circuit board assembly 70.

Please refer to FIGS. 3A and 3B. The magnetic core assembly 60 furtherincludes a plurality of second U-shaped copper structures 603 and athird U-shaped copper structure 602. The two top surfaces of the thirdU-shaped copper structure 602 are welded on and electrically connectedwith the two first bonding pads P1 on the second surface 50 b of thefirst printed circuit board 501. The bottom surface of the thirdU-shaped copper structure 602 is welded on and electrically connectedwith the fourth bonding pad P4 of the second circuit board assembly 70.The two top surfaces of each second U-shaped copper structure 603 arewelded on and electrically connected with the corresponding two secondbonding pads P2 on the second surface 50 b of the first printed circuitboard 501. The bottom surface of each second U-shaped copper structure603 is welded on and electrically connected with the corresponding fifthbonding pad P5 of the second circuit board assembly 70.

The heights of the first U-shaped copper structures 621, 623, 625, 627,the second U-shaped copper structures 603 and the third U-shaped copperstructure 602 are equal or substantially the same. Moreover, the shapesof the inner surfaces of the third U-shaped copper structure 602 and thesecond U-shaped copper structures 603 match the shape of the magneticcore portion 610. The outer surfaces of the third U-shaped copperstructure 602 and the second U-shaped copper structures 603 are flat.The first U-shaped copper structures 621, 623, 625, 627, the secondU-shaped copper structure 603 and the third U-shaped copper structure602 are supported between the first circuit board assembly 50 and thesecond circuit board assembly 70. Consequently, the capability of thevoltage regulator module 3 to withstand the pressure from the casing ofthe electronic device will be enhanced. Due to the good thermalconductivity of copper, the heat from the inductor L can be transferredto the second circuit board assembly 70 rapidly and effectively.Consequently, the thermal resistance in the thermal conduction path isdecreased.

The first U-shaped copper structures 621, 623, 625, 627, the secondU-shaped copper structures 603 and the third U-shaped copper structure602 can provide the good supporting capability. Consequently, themagnetic core portion 610 may be slightly shorter than the firstU-shaped copper structures 621, 623, 625, 627, the second U-shapedcopper structures 603 and the third U-shaped copper structure 602. Inthis design, the pressure to be withstood by the magnetic core portion610 is reduced. Consequently, the possibility of causing the crack ofthe magnetic core portion 610 by the large pressure will be minimized.

A process of assembling the magnetic core assembly 60 will be descriedas follows. Firstly, the top surfaces of the first U-shaped copperstructures 621, 623, 625, 627, the second U-shaped copper structures 603and the third U-shaped copper structure 602 face upwardly. Then, theinner sides of the bottom surfaces of the first U-shaped copperstructures 621, 623, 625, 627, the second U-shaped copper structures 603and the third U-shaped copper structure 602 are dispensed with glue.Then, the first U-shaped copper structures 621, 623, 625, 627, thesecond U-shaped copper structures 603 and the third U-shaped copperstructure 602 are locked on the magnetic core portion 610. Consequently,the magnetic core assembly 60 is assembled. Then, the magnetic coreassembly 60 is combined with the first circuit board assembly 50 and thesecond circuit board assembly 70 through a welding process.Consequently, the voltage regulator module 3 is produced and theproduction process is simplified. In this embodiment, the shapes of thefirst U-shaped copper structures 621, 623, 625, 627, the second U-shapedcopper structures 603 and the third U-shaped copper structure 602 aresimilar to that of the U-shaped magnetic cores of the conventionalmagnetic components. Therefore, the shapes of the U-shaped copperstructures are not particularly shown in the drawings of the presentdisclosure.

Please refer to FIGS. 3A and 3B again. The voltage regulator module 3further includes a signal communication part 601. The signalcommunication part 601 includes a plurality of pins. The plurality ofpins are divided into a first pin group and a second pin group. Thefirst terminals of the pins in the first pin group are fixed in thecorresponding perforations 511 of the first printed circuit board 501 bywelding. The first terminals of the pins in the second pin group arefixed in the blind holes 512 of the first printed circuit board 501 bywelding. The second terminals of all pins are fixed in the correspondingblind holes 711 of the second printed circuit board 703 by welding. Thesignal communication part 601 is used for transferring the controlsignal between the first circuit board assembly 50 and the secondcircuit board assembly 70.

The uses of the perforations 511 are helpful for fixing the signalcommunication part 601. Due to the blind holes 512, the first surface 50a of the first printed circuit board 501 is retained to mount theseparate components (e.g., the input capacitors Cin). Consequently, thevoltage regulator module 3 can meet the high-power density requirements.Similarly, due to the blind holes 711, the second surface 70 b of thesecond printed circuit board 703 is retained to mount more ball gridarrays B and the inner space of the second printed circuit board 703 isretained to accommodate more separate components (e.g., the outputcapacitors Cout).

Please refer to FIGS. 9A, 9B and 10 . FIG. 9A is a schematic explodedview illustrating a voltage regulator module according to a secondembodiment of the present disclosure and taken along a viewpoint. FIG.9B is a schematic exploded view illustrating the voltage regulatormodule of FIG. 9A and taken along another viewpoint. FIG. 10 is a planarview illustrating a signal communication part of the voltage regulatormodule as shown in FIG. 9A. Component parts and elements correspondingto those of the first embodiment are designated by identical numeralreferences, and detailed descriptions thereof are omitted. In comparisonwith the first embodiment, the signal communication part 661 does notincludes the pins. Instead, the signal communication part 661 includes aconduction circuit board 662. In this embodiment, a plurality ofconduction pads 561 are formed on the second surface 50 b of the firstprinted circuit board 501 to replace the perforations and the blindholes. Similarly, a plurality of conduction pads 761 are formed on thesecond printed circuit board 703 to replace the perforations and theblind holes.

The conduction circuit board 662 includes a plurality of conductionfingers 663 and a plurality of surface pins 664. The plurality ofconduction fingers 663 are located at a first lateral side and a secondlateral side of the conduction circuit board 662, which are opposed toeach other. Every two conduction fingers 663 that are aligned with eachother and located at two opposite sides belong to the same power networkor different power networks. For example, the conduction fingers 663 aregold-plated structures or tin-plated structures. The plurality ofsurface pins 664 are electroplated on the top side and the bottom sideof the conduction circuit board 662. The top side and the bottom side ofthe conduction circuit board 662 are opposed to each other and arrangedbetween the first lateral side and the second lateral side. The firstends of the conduction fingers 663 are contacted with the correspondingtop-side surface pins 664. The second ends of the conduction fingers 663are contacted with the corresponding bottom-side surface pins 664. Incase that a first specified conduction finger 663 and a second specifiedconduction finger 663 located at the two opposite sides belong todifferent power networks, the surface pins 664 contacted with the firstspecified conduction finger 663 and the surface pins 664 contacted withthe second specified conduction finger 663 are not electricallyconnected with each other.

The signal communication part 661 is arranged between the first circuitboard assembly 50 and the second circuit board assembly 70 along avertical direction. The signal communication part 661 is fixed on andelectrically connected with the first circuit board assembly 50 throughthe conduction pads 561 and the corresponding surface pins 664. Thesignal communication part 661 is fixed on and electrically connectedwith the second circuit board assembly 70 through the conduction pads761 and the corresponding surface pins 664.

As previously described, the signal communication part of theconventional voltage regulator module uses a plurality of fins totransfer signal, and thus some drawbacks occur. The signal communicationpart 661 of the voltage regulator module 3 of the present disclosure isspecially designed. While the signal communication part 661 is welded onthe bonding pads of the first circuit board assembly 50 or the secondcircuit board assembly 70, the lateral solder wicking efficacy isachieved and the soldering material is not spread to the adjacent pins.Since the soldering materials between the two surface pins 664 are notconnected, the short-circuited problem is avoided. Under thiscircumstance, the gap between the adjacent surface pins 664 of thesignal communication part 661 is reduced, and the pins distributiondensity is increased. Consequently, the volume of the voltage regulatormodule 3 is reduced, and power density of the voltage regulator module 3is enhanced. Moreover, since the conduction circuit board 662 of thesignal communication part 661 is decreased, the size of the signalcommunication part 661 is reduced and the overall size of the voltageregulator module 3 is reduced. Consequently, more space can be providedto mount other separate components (e.g., the output capacitors Cout).It is noted that numerous modifications and alterations may be madewhile retaining the teachings of the disclosure. For example, in anotherembodiment, the signal communication part 661 is electrically connectedwith the first circuit board assembly 50 or the second circuit boardassembly 70 through a single-side wiring pattern or through theinterconnect traces of the conduction circuit board.

In another embodiment, the signal communication part 661 is adhered onthe magnetic core portion 610 or at least one of the first U-shapedcopper structures 621, 623, 625, 627, the second U-shaped copperstructures 603 and the third U-shaped copper structure 602 to define asignal communication module. The signal communication module 661 isdirectly installed between the first circuit board assembly 50 and thesecond circuit board assembly 70. Since the signal communication part661 is adhered on the magnetic core portion 610 or at least one of theU-shaped copper structures, the perforations or blind holes can beomitted. In such way, the first circuit board assembly 50 and the secondcircuit board assembly 70 are not inclined during the welding process,the size of the voltage regulator module 3 is reduced, and productionprocess is simplified. Moreover, since the conduction circuit board 662of the signal communication part 661 is arranged vertically, the heightof the conduction circuit board 662 can be adjusted more precisely.Under this circumstance, the smoothness of the contact surface betweenthe magnetic core assembly 60 and the first circuit board assembly 50(and the second circuit board assembly 70) will be enhanced.

As mentioned above, the plurality of ball grid arrays B are disposed onthe second surface 70 b of the second printed circuit board 703, and thefirst surface 70 a of the second printed circuit board 703 (or thesurface of the second printed circuit board 703 beside the magnetic coreassembly 60) has to be welded and combined with the magnetic coreassembly 60. In accordance with the conventional double-side reflowprocess, the first surface of the printed circuit board is coated withsoldering paste and then the component is placed on the soldering paste.After a first reflow process is completed, the second surface of theprinted circuit board is coated with soldering paste and the componentis placed on the soldering paste. Then, a second reflow process isperformed. However, when the second reflow process is performed on thesecond surface of the printed circuit board, the solder point on thefirst surface is heated and possibly molten. Under this circumstance,the component is detached from the printed circuit board. Especiallywhen the component is large and weighty, the problem is more serious.For solving this problem, the temperature of the second reflow processis 5 degrees lower than the temperature of the first reflow process.

In accordance with the present disclosure, the second surface 50 b ofthe first printed circuit board 501 is an internal welding surface, andthe first surface 70 a of the second printed circuit board 703 (or thesurface of the second printed circuit board 703 beside the magnetic coreassembly 60) is also an internal welding surface. After the voltageregulator module 3 is assembled, the second surface 70 b of the secondprinted circuit board 703 has to be welded on the system board throughthe plurality of ball grid arrays B. Since the internal solder points ofthe voltage regulator module 3 are molten twice, the components arepossibly shifted. The voltage regulator module 3 and the centralprocessing unit are located at two opposite sides of the system board.After the voltage regulator module 3 is welded on the system board, thesystem board is turned over and then the central processing unit iswelded on the system board. During the process of welding the centralprocessing unit, the ball grid arrays B, the solder points on the firstsurface 70 a of the second printed circuit board 703 or the solderpoints on the second surface 50 b of the first printed circuit board 501are molten again because of the large weight of the voltage regulatormodule 3. Meanwhile, the internal components of the voltage regulatormodule 3 are possibly detached.

For overcoming the above drawbacks, the magnetic core assembly 60 isfixed on the first circuit board assembly 50 and/or the second circuitboard assembly 70 through a conductive adhesive. After the conductiveadhesive is heated and solidified, the conductive adhesive is not moltenor deformed again. Consequently, the problems of detaching or shiftingthe components during the welding process will be avoided, and thereliability and convenience of assembling the voltage regulator module 3will be enhanced. Moreover, since the soldering material is replaced bythe conductive adhesive, the number of the reflow processes is largelyreduced and the product reliability is increased.

It is noted that numerous modifications and alterations may be madewhile retaining the teachings of the disclosure. For example, in anotherembodiment, the voltage regulator module is equipped with the firstcircuit board assembly 50 and the magnetic core assembly 60 and notequipped with the second circuit board assembly 70. Under thiscircumstance, the output capacitor Cout is mounted on the system boardof the electronic device, and the bottom surfaces of the U-shaped copperstructures of the magnetic core assembly 60 are directly welded on thecorresponding bonding pads of the system board or fixed on the systemboard through the conductive adhesive. In other words, the secondcircuit board assembly 70 in the first embodiment or the secondembodiment is replaced by the system board.

While the disclosure has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the disclosure needs not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

What is claimed is:
 1. An electronic device, comprising: a system boardcomprising a first surface and a second surface opposite to each other,wherein a semiconductor device is disposed on the first surface of thesystem board; a power module disposed on the second surface of thesystem board, wherein the power module provides power to thesemiconductor device through the system board; and a conductive partdisposed on a first side of the power module adjacent to the secondsurface of the system board, wherein the conductive part is used to fixthe power module on the system board, and is electrically connected withthe power module and the system board, wherein the power is transmittedbetween the power module and the semiconductor device through theconductive part; wherein the power module comprises: at least one switchcircuit disposed on a second side of the power module away from theconductive part; and a magnetic core assembly arranged between theswitch circuit and the conductive part; wherein a vertical projection ofthe semiconductor device on the system board, a vertical projection ofthe conductive part on the system board and a vertical projection of theswitch circuit on the system board are partially overlap.
 2. Theelectronic device according to claim 1, wherein each of the at least oneswitch circuit comprises two switches connected in series and a driver,and the driver drives the two switches to turn on and turn off.
 3. Theelectronic device according to claim 1, wherein the switch circuit, themagnetic core assembly and the conductive part are disposed in sequencealong a same direction.
 4. The electronic device according to claim 1,wherein the vertical projection of the switch circuit on the systemboard and a vertical projection of the magnetic core assembly on thesystem board are partially overlap.
 5. The electronic device accordingto claim 1, wherein the semiconductor device is a central processingunit, and the conductive part comprises a plurality of ball grid arraysor a plurality of soldering pads; the power module is voltage regulatormodule.
 6. The electronic device according to claim 1, wherein themagnetic core assembly comprises a winding and a magnetic core portionwith at least one opening, wherein the winding is penetrated through theopening so that the magnetic core assembly is formed by the winding andthe magnetic core portion, wherein one terminal of the winding iselectrically connected with the switch circuit, and the other terminalof the winding is electrically connected with the conductive part. 7.The electronic device according to claim 6, wherein the power modulecomprises a first circuit board assembly arranged in the second side ofthe power module and comprising a first printed circuit board and afirst molding compound layer, wherein the switch circuit is disposed ona first surface of the first printed circuit board, and the firstmolding compound layer is formed on the first surface of the firstprinted circuit board to encapsulate the switch circuit, wherein themagnetic core assembly is arranged beside a second surface of the firstprinted circuit board, and the winding comprises at least one firstU-shaped copper structure, wherein the at least one opening comprises aplurality of openings, and each of the at least one first U-shapedcopper structure is penetrated through two corresponding openings todefine at least two inductors, wherein a first terminal of each inductorand the corresponding switch circuit are connected in series to define aphase circuit.
 8. The electronic device according to claim 7, furthercomprising a second circuit board assembly arranged in the first side ofthe power module, wherein the second circuit board assembly is arrangedbeside the magnetic core assembly, and the magnetic core assembly isarranged between the first circuit board assembly and the second circuitboard assembly, wherein the second circuit board assembly comprises asecond printed circuit board and at least one output capacitor, a firstsurface and a second surface of the second printed circuit board areopposed to each other, and the first surface of the second printedcircuit board is arranged beside the magnetic core assembly.
 9. Theelectronic device according to claim 8, wherein the magnetic coreassembly further comprises at least one second U-shaped copper structureand a third U-shaped copper structure, wherein a height of the magneticcore portion is lower than a height of the first U-shaped copperstructure, a height of the second U-shaped copper structure and a heightof the third U-shaped copper structure.
 10. The electronic deviceaccording to claim 9, wherein two first bonding pads and at least onepair of second bonding pads are disposed on the second surface of thefirst printed circuit board, and the second circuit board assemblyfurther comprises a fourth bonding pad and at least one fifth bondingpad, wherein the first bonding pads and the fourth bonding pad areelectrically connected with a positive input end of the power module,the second bonding pads and the at least one fifth bonding pad areelectrically connected with a negative output terminal of the powermodule, the third U-shaped copper structure is fixed on and electricallyconnected with the two first bonding pads and the fourth bonding pad,each second U-shaped copper structure is fixed on and electricallyconnected with the corresponding pair of second bonding pads and thecorresponding fifth bonding pad, and the first circuit board assemblyand the second circuit board assembly are supported by the at least onefirst U-shaped copper structure, the at least one second U-shaped copperstructure and the third U-shaped copper structure.
 11. The electronicdevice according to claim 8, wherein an even number of third bondingpads are disposed on the second surface of the first printed circuitboard, and the second circuit board assembly further comprises at leastone sixth bonding pad, wherein each third bonding pad is electricallyconnected with the first terminal of the corresponding inductor, the atleast one sixth bonding pad is electrically connected with a positiveoutput terminal of the power module, and each first U-shaped copperstructure is fixed on and electrically connected with the correspondingtwo third bonding pads and the corresponding sixth bonding pad.
 12. Theelectronic device according to claim 11, wherein each first U-shapedcopper structure comprises two top surfaces and a bottom surface,wherein the two top surfaces of the first U-shaped copper structure arefixed on and electrically connected with the corresponding two thirdbonding pads, and the bottom surface of the first U-shaped copperstructure is fixed on and electrically connected with the correspondingsixth bonding pad.
 13. The electronic device according to claim 8,wherein the at least one output capacitor is embedded within the secondprinted circuit board, and the plurality of ball grid arrays aredisposed on the second surface of the second printed circuit board, theplurality of ball grid arrays is used as the conductive part.
 14. Theelectronic device according to claim 8, wherein the output capacitor ismounted on the first surface of the second printed circuit board througha plastic molding process, and the plurality of ball grid arrays aredisposed on the second surface of the second printed circuit board. 15.The electronic device according to claim 14, wherein the second circuitboard assembly further comprises a plurality of copper blocks and asecond molding compound layer, wherein the plurality of copper blocksare fixed on the first surface of the second printed circuit board toprovide a supporting function, and the first surface of the secondprinted circuit board, the at least one output capacitor and theplurality of copper blocks are encapsulated by the second moldingcompound layer through a plastic molding process, wherein a top surfaceof each copper block is exposed outside the second molding compoundlayer.
 16. The electronic device according to claim 15, wherein each ofthe copper blocks has a rectangular structure; or wherein each of thecopper blocks has a trapezoid column structure with a bottom surface anda top surface, wherein the bottom surface and the top surface areparallel with each other, and an area of the bottom surface is smallerthan an area of the top surface, wherein the bottom surface of thetrapezoid column structure is fixed on the first surface of the secondprinted circuit board, the top surface of the trapezoid column structureis exposed outside the second molding compound layer, and a bonding padis electroplated on the top surface of the trapezoid column structure;wherein the area of the top surface of the trapezoid column structure isat least 1.3 times the area of the bottom surface of the trapezoidcolumn structure.
 17. The electronic device according to claim 8,wherein a plurality of perforations and a plurality of first blind holesare formed in the second surface of the first printed circuit board, anda plurality of second blind holes are formed in the first surface of thesecond printed circuit board, wherein the power module further comprisesa signal communication part with a plurality of pins, and the pluralityof pins are divided into a first pin group and a second pin group,wherein first terminals of the pins in the first pin group are fixed inthe corresponding perforations of the first printed circuit board, firstterminals of the pins in the second pin group are fixed in the firstblind holes of the first printed circuit board, second terminals of theplurality of pins are fixed in the corresponding second blind holes ofthe second printed circuit board, and a control signal is transmittedbetween the first circuit board assembly and the second circuit boardassembly through the signal communication part.
 18. The electronicdevice according to claim 8, wherein a plurality of first conductionpads are formed on the second surface of the first printed circuitboard, a plurality of second conduction pads are formed on the secondprinted circuit board, the power module comprises a signal communicationpart with a conduction circuit board, and the conduction circuit boardcomprises a plurality of conduction fingers and a plurality of surfacepins, wherein the plurality of conduction fingers are formed on at leastone lateral side of the conduction circuit board, the plurality ofsurface pins are electroplated on a top side and a bottom side of theconduction circuit board, a first end of each conduction finger iscontacted with the corresponding surface pin on the top side, and asecond end of each conduction finger is contacted with the correspondingsurface pin on the bottom side, wherein the signal communication part isarranged between the first circuit board assembly and the second circuitboard assembly along a vertical direction, the signal communication partis fixed on and electrically connected with the first circuit boardassembly through the first conduction pads of the first printed circuitboard and the corresponding surface pins, the signal communication partis fixed on and electrically connected with the second circuit boardassembly through the second conduction pads of the second printedcircuit board and the corresponding surface pins, and a control signalis transmitted between the first circuit board assembly and the secondcircuit board assembly through the signal communication part.
 19. Theelectronic device according to claim 8, wherein the magnetic coreassembly is fixed on the first circuit board assembly through aconductive adhesive; wherein the magnetic core assembly is fixed betweenthe first circuit board assembly and the second circuit board assemblythrough a conductive adhesive; wherein electronic device furthercomprising an input capacitor, wherein the input capacitor is disposedon the first surface of the first printed circuit board and encapsulatedby the first molding compound layer, wherein a first terminal of theinput capacitor is electrically connected with a positive input end ofthe power module, and a second terminal of the input capacitor iselectrically connected with a negative input end of the power module.20. The electronic device according to claim 8, wherein an externalsurface of the first molding compound layer is a flat surface; whereineach of the at least one switch circuit is a driver andmetal-oxide-semiconductor field-effect transistor, and the driver andmetal-oxide-semiconductor field-effect transistor comprises a first heatdissipation surface and a second heat dissipation surface, wherein thefirst heat dissipation surface and the second heat dissipation surfaceare opposed to each other, the first heat dissipation surface is incontact with the first surface of the first printed circuit board, andthe second heat dissipation surface is exposed outside the externalsurface of the first molding compound layer.